Integration and characterization of gas cluster processing for copper interconnects electromigration improvement
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E. Petitprez | T. Chevolleau | G. Imbert | Y. L. Friec | M. Hopstaken | J. Torres | M. Tabat | J. Hautala | L. Gosset | S. Sherman | V. Girault | J. Guillan | S. Jullian | R. Gras | J. Bienacel