Micromechanical Velcro

The authors have developed arrays of micromechanical mating structures, fabricated with silicon micromachining techniques, which act as mechanical adhesives. The microstructures are fabricated on standard silicon wafers, with an areal density of approximately 200000 per cm/sup 2/. The microstructures on two identical surfaces will self-align and interlock with each other under application of adequate external pressure. A tensile strength per unit interlocked area of 1.1 MPa, or 160 psi, has been achieved. In this work, the authors describe the design and fabrication of this micromechanical Velcro; the authors also present results of their experimental tests, a theoretical estimate of the tensile strength, and design constraints. >