Plastic Ball Grid Array Solder Joint Reliability for Avionics Applications

The solder-joint reliability of plastic ball grid array (PBGA) packages for an avionics application was assessed. The fatigue life under combined temperature cycling and random vibration conditions was initially simulated using analytical models. Further simulation was used to plan an accelerated test and to estimate an acceleration factor between field conditions and test conditions, and experimentally verified. The combination of simulation and experimental results was then used to reassess the solder-joint reliability under field conditions. Based on the simulation and test results, it was estimated that PBGA packages without underfill would not satisfy the long-term life expectation for the avionics application under study. In addition, the experimental results also show that the simple application of linear damage superposition (Miner's rule), which neglects the interactions between loads, will underestimate the damage and overpredict the product life. Therefore, calculating the acceleration factor is necessary and cost-efficient for providing the basis of product field reliability assessment

[1]  M. Crisfield.  A four-noded thin-plate bending element using shear constraints—a modified version of lyons' element , 1983 .

[2]  T. A. Wyatt.  Vibrations of engineering structures , 1986 .

[3]  M. Pecht,et al.  Failure analysis and virtual qualification of PBGA under multiple environmental loadings , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[4]  E. Jan Vardaman,et al.  The market for ball grid array packages , 1995, Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium.

[5]  C. Basaran,et al.  Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading , 2002 .

[6]  Michael Pecht,et al.  PWB solder joint life calculations under thermal and vibrational loading , 1991, Annual Reliability and Maintainability Symposium. 1991 Proceedings.

[7]  M. Osterman,et al.  Plastic Ball-Grid-Arrays (PBGA): Are they ready for environmentally harsh Aerospace applications? , 2002 .

[8]  Abhijit Dasgupta,et al.  A Demonstration of Virtual Qualification for the Design of Electronic Hardware , 2001 .

[9]  M. Pecht,et al.  Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach , 1990 .

[10]  H. Saunders,et al.  Vibration of Engineering Structures , 1988 .

[11]  Anthony J. Rafanelli,et al.  Plastic Encapsulated Microelectronics; Materials, Processes, Quality, Reliability, and Application , 1997 .

[12]  Werner Engelmaier,et al.  Solder Attachment Reliability, Accelerated Testing, and Result Evaluation , 1991 .