Nanoscale ultra-thin-body silicon-on-insulator P-MOSFET with a SiGe/Si heterostructure channel

We report the concept and demonstration of a nanoscale ultra-thin-body silicon on-insulator (SOI) P-channel MOSFET with a Si/sub 1-x/Ge/sub x//Si heterostructure channel. First, a novel lateral solid-phase epitaxy process is employed to form an ultra-thin-body that suppresses the short-channel effects. Negligible threshold voltage roll-off is observed down to a channel length of 50 nm. Second, a selective silicon implant that breaks up the interfacial oxide is shown to facilitate unilateral crystallization to form a single crystalline channel. Third, the incorporation of SiGe in the channel resulted in a 70% enhancement in the drive current.

[1]  G. E. Pikus,et al.  Symmetry and strain-induced effects in semiconductors , 1974 .

[2]  H. Wong,et al.  Three-dimensional "atomistic" simulation of discrete random dopant distribution effects in sub-0.1 /spl mu/m MOSFET's , 1993, Proceedings of IEEE International Electron Devices Meeting.

[3]  D. Harame,et al.  High-mobility modulation-doped SiGe-channel p-MOSFETs , 1991, IEEE Electron Device Letters.

[4]  J. Kedzierski,et al.  A bulk-Si-compatible ultrathin-body SOI technology for sub-100 nm MOSFETs , 1999, 1999 57th Annual Device Research Conference Digest (Cat. No.99TH8393).

[5]  K.P. MacWilliams,et al.  Enhancement-mode quantum-well Ge/sub x/Si/sub 1-x /PMOS , 1991, IEEE Electron Device Letters.

[6]  I. Adesida,et al.  High speed p-type SiGe modulation-doped field-effect transistors , 1996, IEEE Electron Device Letters.