Atpg For Heat Dissipation Minimization During Scan Testing

An ATPG technique is proposed that reduces heat dissipation during testing of sequential circuits that have fill-scan. The objective is to permit safe and inexpensive testing of low power circuits and bare die that would otherwise require expensive heat removal equipment for testing at high speeds. The proposed ATPG exploits all don’t cares that occur during scan shijting, test application, and response capture to minimize switching activity in the circuit under test. Furthermore, an ATPG that maximizes the number of state inputs that are assigned don’t care values, has been developed. The proposedtechnique has been implemented and used to generate tests for f i l l scan versions of ISCAS 89 benchmark circuits. These tests decrease the average number of transitions during test by 19% to 89%. when comparedwith those generated by a simple PODEMim-

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