Study on Fine Finishing Process Using Liquid-Bonded Wheel (1st Report)

Study on Fine Finishing Process Using Liquid-Bonded Wheel (1st Report) Increase of Critical Endurable Pressure of Liquid-Bonded Wheel in Machining Kenji KAWATA and Yasuhiro TANI The paper is concerned with the increase of endurable pressure in machining of a new lapping wheel named "Liquid-Bonded Wheel". The bond strength of this wheel is smaller than that of conventional grinding wheels. But endurable pressure of this wheel becomes high enough to withstand the mechanical shock of bumping to the workpiece and machining by employing some technique as follows. (1) Improving the angular accuracy of the axis of the main spindle of machine. (2) Using finer abrasives for increasing the contact points by unit volume of stacked grains in the wheel. (3) Using combination in still finer grains with the fine grains for increasing the density of the mixture. The wheel employing these technique has the endurable pressure of about 1 MPa in machining. Moreover, packing the vessel uniformly with abrasive grains may be important, for an uneven packing may deteriorate the flatness of the working surface of the wheel, and the flatness may influence the geometrical accuracy of the finished surface of workpiece. The wheel packed uniformly with grains is manufactured by covering the bottom of a mold with some annular plates.