Effects of composition and reflowing on the corrosion behavior of Sn-Zn deposits in brine media

[1]  Chi-Chang Hu,et al.  Composition control of tin–zinc deposits using experimental strategies , 2006 .

[2]  Chi-Chang Hu,et al.  Anodic stripping of zinc deposits for aqueous batteries: effects of anions, additives, current densities, and plating modes , 2004 .

[3]  Norio Kaneko,et al.  Sn-Ag Solder Bump Formation for Flip-Chip Bonding by Electroplating , 2003 .

[4]  Chi-Chang Hu,et al.  The corrosion behavior of Ni–P deposits with high phosphorous contents in brine media , 2003 .

[5]  B. Popov,et al.  Corrosion Protection of Steel Using Nonanomalous Ni-Zn-P Coatings , 2003 .

[6]  V. Vivier,et al.  EIS investigation of zinc dissolution in aerated sulphate medium. Part II: zinc coatings , 2002 .

[7]  Y. Zhang,et al.  Electroplating and Properties of SnBi and SnCu for Lead-Free Finishes , 2002 .

[8]  K. Weil,et al.  EQCM studies of the electrodeposition and corrosion of tin–zinc coatings , 2001 .

[9]  Chi-Chang Hu,et al.  Electrochemical impedance characterization of polyaniline-coated graphite electrodes for electrochemical capacitors — effects of film coverage/thickness and anions , 2001 .

[10]  Kwang-Lung Lin,et al.  The electrochemical corrosion behaviour of Pb-free Al-Zn-Sn solders in NaCl solution , 1998 .

[11]  Kwang-Lung Lin,et al.  The potentiodynamic polarization behavior of Pb-free XIn-9(5Al-Zn)-YSn solders , 1998 .

[12]  K. Tu Cu/Sn interfacial reactions: thin-film case versus bulk case , 1996 .

[13]  C. Eisenmenger‐Sittner,et al.  Whisker growth on sputtered AlSn (20 wt.% Sn) films , 1995 .

[14]  M. A. Whitmore,et al.  Alternative Solders for Electronics Assemblies: Part 2: UK Progress and Preliminary Trials , 1993 .

[15]  G. Allan Heterojunctions and Semiconductor Superlattices , 1986 .

[16]  M. Pourbaix Atlas of Electrochemical Equilibria in Aqueous Solutions , 1974 .

[17]  K. Weil,et al.  Corrosion behavior of electroplated tin-zinc coatings , 2004 .

[18]  B. Moran,et al.  Mechanical Behavior of Eutectic Sn-Ag and Sn-Zn Solders , 1995 .

[19]  J. Glazer Metallurgy of low temperature Pb-free solders for electronic assembly , 1995 .

[20]  B. Conway,et al.  Problem of in situ real-area determination in evaluation of performance of rough or porous, gas-evolving electrocatalysts. Part 1.—Basis for distinction between capacitance of the double layer and the pseudocapacitance due to adsorbed H in the H2 evolution reaction at Pt , 1993 .