Technology with the Environment in Mind

Intel has been continuously striving to provide environmentally green micro-electronic packaging solutions for high-density interconnect (HDI) product applications. The environmentally green initiative consisted of providing lead-free (Pb-free) packaging materials solutions as well the enabling of halogen-free (HF) substrates technology to eliminate the use of brominated flame retardants. This paper discusses the challenges overcome by Intel to deliver on both aspects of environmentally green packaging. Although Intel’s efforts to enable Pb-free and HF-compliant packaging solutions have been wide-ranging, the scope of this paper is limited to discussing the key technology development challenges faced in transitioning to Pb-free materials in first-level interconnects (FLI), second-level interconnects (2LI), solder thermal interface materials (STIM) applications, and halogen-free (HF) substrate materials. The transition to Pb-free micro-electronic packaging materials and HF substrate technology required a paradigm shift in the industry, needing extensive benchmarking initiatives and sharing cross-technology learnings across the industry and academia. The delivery of Pb-free packaging solutions across FLI, 2LI, and STIM applications as well as HF substrate technology has strongly reinforced Intel’s One Generation Ahead (OGA) philosophy in micro-electronic packaging.