Nanoindentation for reliability assessment of ULK films and interconnects structures

[1]  K. Zeng,et al.  Interfacial delamination cracking shapes and stress states during wedge indentation in a soft-film-on-hard-substrate system—Computational simulation and experimental studies , 2011 .

[2]  H. Engelmann,et al.  Multi-Scale Mechanical Probing Techniques To Investigate The Stability Of BEOL Layer Stacks With Sub-100 nm Structures , 2011 .

[3]  R. Dauskardt,et al.  Cohesive Toughness Of Low-k Film With Periodically Changing Elastic Modulus: Cube- Corner Indentation , 2010 .

[4]  K. M. Chen,et al.  Copper pillar bump design optimization for lead free flip-chip packaging , 2010 .

[5]  G. Liu,et al.  Finite element simulation and experimental determination of interfacial adhesion properties by wedge indentation , 2009 .

[6]  J. Vlassak,et al.  The effect of porogen loading on the stiffness and fracture energy of brittle organosilicates , 2009 .

[7]  J. Vlassak,et al.  PECVD low-permittivity organosilicate glass coatings: Adhesion, fracture and mechanical properties , 2008 .

[8]  K. Zeng,et al.  Determining the interfacial toughness of low-k films on Si substrate by wedge indentation: Further studies , 2008 .

[9]  Lu Shen,et al.  Determining interfacial properties of submicron low-k films on Si substrate by using wedge indentation technique , 2007 .

[10]  G. Beyer,et al.  Thermomechanical properties of thin organosilicate glass films treated with ultraviolet-assisted cure , 2007 .

[11]  Paul S. Ho,et al.  Chip‐Packaging Interaction and Reliability Impact on Cu/Low k Interconnects , 2006 .

[12]  Xiang Dai,et al.  Reliability issues for flip-chip packages , 2004, Microelectron. Reliab..

[13]  R. Dauskardt,et al.  Fracture of nanoporous thin-film glasses , 2004, Nature materials.

[14]  Karen Maex,et al.  Low dielectric constant materials for microelectronics , 2003 .

[15]  A. Volinsky,et al.  Fracture toughness, adhesion and mechanical properties of low-K dielectric thin films measured by nanoindentation , 2003 .

[16]  Kathryn J. Wahl,et al.  Quantitative imaging of nanoscale mechanical properties using hybrid nanoindentation and force modulation , 2001 .

[17]  J. Vlassak,et al.  A simple technique for measuring the adhesion of brittle films to ductile substrates with application to diamond-coated titanium , 1997 .

[18]  M. P. Boer,et al.  Microwedge indentation of the thin film fine line—I. Mechanics , 1996 .

[19]  Anthony G. Evans,et al.  Measurement of adherence of residually stressed thin films by indentation. I. Mechanics of interface delamination , 1984 .