In-die mask registration measurement with existing inspection tools

The demand for aggressive image placement accuracy for each generation is being increasingly accelerated by DPT deployment. The method of the correction with the scanner is in effect devised by obtaining the CD and IP maps of each mask after the mask pattern is drawn, We are developing a technology that generates CD and IP maps for each mask from the image data of inspection equipment with the ultimate goal of "in-die overlay improvement" optimizing scanner as well as writer performances. We have reported in-die CD and registration metrology capability of mask inspection equipment. However existing inspection machines, which are already in use, do not have such features to perform this function, as they are not designed for such purpose. We are developing a method to improve measurement accuracy by incorporating registration mark data obtained by conventional metrology tool, and will report the result of evaluation of this method.

[1]  Shuichi Tamamushi,et al.  CD inspection by Nuflare NPI 6000 tool , 2010, Photomask Technology.

[2]  T. Touya,et al.  Evaluation of metrology capabilities of mask inspection equipment , 2010, Photomask Japan.

[3]  Hirokazu Yanagihara,et al.  On Avoidance of the Over-fitting in the B-Spline Non-parametric Regression Model , 2004 .

[4]  Sang-Gyun Woo,et al.  IntenCD: an application for CD uniformity mapping of photomask and process control at maskshops , 2008, Photomask Japan.

[5]  Carl Hess,et al.  Reticle inspection-based critical dimension uniformity , 2009, Photomask Japan.

[6]  Shuichi Tamamushi,et al.  Using metrology capabilities of mask inspection equipment for optimizing total lithography performance , 2009, Photomask Technology.

[7]  Yoshitake Tsuji,et al.  Development of next-generation mask inspection method by using the feature of mask image captured with 199-nm inspection optics , 2006, SPIE Photomask Technology.

[8]  Shmoolik Mangan,et al.  IntenCD: mask critical dimension variation mapping , 2008, Photomask Japan.

[9]  Takashi Kamikubo,et al.  Modeling of charging effect and its correction by EB mask writer EBM-6000 , 2008, Photomask Japan.

[10]  Yoshitake Tsuji,et al.  Development of advanced mask inspection optics with transmitted and reflected light image acquisition , 2007, SPIE Advanced Lithography.

[11]  Osamu Suga,et al.  Development of advanced reticle inspection apparatus for hp 65 nm node device and beyond , 2006, Photomask Japan.