Investigation of Rapid-Prototyping Methods for 3D Printed Power Electronic Module Development

The recent research in wide-bandgap (WBG) power electronic semiconductors has produced a wide variety of device and combinational topologies, such as HFETS, MOSHFETS, and the Cascode Pair. Each variation needs to be tested with certain package criteria (e.g. high voltage SiC devices up to 15kV, high current GaN devices up to 300A, or unprecedented high frequencies). Having a common package is costly and cannot provide an investigation of optimized performance. Hence, use of a rapid prototyping method to print power electronic packages and modules is needed. Also, the continual move to higher frequencies will require greater integration of packaging into the end application, as is presently done with point-of-load converters. The future modules will take on more functional integration, including more mechanical features, which further supports use of printed fabrication technologies. It is not reasonable to assume that a complete module can be directly printed, though most would be; some assembly is requir...