Resistivity of copper interconnects at 28 nm pitch and copper cross-sectional area below 100 nm2
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E. Joseph | C. Lavoie | M. Guillorn | D. Klaus | M. Brink | H. Miyazoe | C. Breslin | L. Gignac | R. Bruce | D. Park | M. Lofaro | A. Pyzyna | H. Tsai | K. Rodbell