Process integration of a 27nm, 16Gb Cu ReRAM
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K. Aratani | S. Yasuda | K. Prall | S. Chhajed | Wataru Otsuka | M. Tsukamoto | S. Mayuzumi | A. Calderoni | N. Ramaswamy | J. Zahurak | K. Miyata | Mark E Fischer | Murali Balakrishnan | David Wells | Hong Li | A. Torsi | Jay Lim | Mark Korber | K. Nakazawa | M. Honda | S. Sills | Beth Cook | Gowrisankar Damarla | H. Tran | Bei Wang | Christopher Cardon | K. Karda | J. Okuno | A. Johnson | Takafumi Kunihiro | Jun Sumino