论文信息 - High-Density Solder Bump Interconnect for MEMS Hybrid Integration - 字舞流文

High-Density Solder Bump Interconnect for MEMS Hybrid Integration

W. Lai | T. Sorsch | V. Aksyuk | J. Gates | R. Frahm | N. Basavanhally | D. Ramsey | F. Pardo | C. Pai | E. Ferry | F. Klemens | W. Mansfield | R. Cirelli | D. López | E. Bower | L. Yee | R. Papazian | P. Watson