Mitigation and Mechanism of Tin Whisker on Micro-bumps by Hard and Soft Underfills

[1]  Yunwen Wu,et al.  Modeling of growth rate and morphology mechanism of whisker and hillock on micro-bumps under temperature-pressure-humidity storage , 2022, Scripta Materialia.

[2]  Junghyun Cho,et al.  Improved adhesion of polyurethane-based nanocomposite coatings to tin surface through silane coupling agents , 2021 .

[3]  Junghyun Cho,et al.  Long-term thermal aging of parylene conformal coating under high humidity and its effects on tin whisker mitigation , 2021 .

[4]  Yunwen Wu,et al.  Growth behavior of tin whisker and hillock on Cu/Ni/SnAg micro-bumps under high temperature and humidity storage , 2021 .

[5]  Yong Liu,et al.  A Direct Multi-Field Coupling Methodology for Modeling Moisture-Induced Stresses and Delamination in Electronic Packages , 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).

[6]  T. Hang,et al.  Inhibition of tin whisker by electroplating ultra-thin Co-W amorphous barrier layer , 2020 .

[7]  T. Hang,et al.  The influence of non-uniform copper oxide layer on tin whisker growth and tin whisker growth behavior in SnAg microbumps with small diameter , 2020, Materials Letters.

[8]  T. Ohshima,et al.  Effect of coating adhesion and degradation on tin whisker mitigation of polyurethane-based conformal coatings , 2019, Polymer Degradation and Stability.

[9]  Junghyun Cho,et al.  Improved adhesion of polyurethane-based coatings to tin surface , 2019, Journal of Materials Science: Materials in Electronics.

[10]  Ming Li,et al.  Growth behavior of tin whisker on SnAg microbump under compressive stress , 2018 .

[11]  Ming Li,et al.  Mitigation of tin whisker growth by inserting Ni nanocones , 2017 .

[12]  B. Majumdar,et al.  Elimination of tin whisker growth by indium addition to electroplated tin in electronic packages , 2017, 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).

[13]  K. Tu,et al.  Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter , 2016 .

[14]  M. Gomez,et al.  Enhanced mechanical properties of polyurethane composite coatings through nanosilica addition , 2016 .

[15]  M. Osterman,et al.  Reliability of conformal coated surface mount packages , 2016, 2016 IEEE Accelerated Stress Testing & Reliability Conference (ASTR).

[16]  M. Osterman,et al.  Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth , 2014 .

[17]  A. Bower,et al.  Growth of whiskers from Sn surfaces: Driving forces and growth mechanisms , 2013 .

[18]  C. K. Chung,et al.  Single-joint shear strength of micro Cu pillar solder bumps with different amounts of intermetallics , 2013, Microelectron. Reliab..

[19]  G. Stafford,et al.  Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers , 2013, Journal of Electronic Materials.

[20]  Michael Osterman,et al.  Evaluation of Effectiveness of Conformal Coatings as Tin Whisker Mitigation , 2012, Journal of Electronic Materials.

[21]  C. Yang,et al.  Corrosion behavior, whisker growth, and electrochemical migration of Sn-3.0Ag-0.5Cu solder doping with In and Zn in NaCl solution , 2011, Microelectron. Reliab..

[22]  K. Suganuma,et al.  Sn whisker growth during thermal cycling , 2011 .

[23]  Barbara Horváth,et al.  Effects of humidity on tin whisker growth — Investigated on Ni and Ag underplated layer construction , 2011 .

[24]  Jay Brusse,et al.  Long Term Investigation of Urethane Conformal Coating Against Tin Whisker Growth , 2010 .

[25]  U. Welzel,et al.  Evolution of microstructure and stress of and associated whisker growth on Sn layers sputter-deposited on Cu substrates , 2010 .

[26]  B. Michel,et al.  Mechanism of Moisture Diffusion, Hygroscopic Swelling, and Adhesion Degradation in Epoxy Molding Compounds , 2010 .

[27]  P. Vianco,et al.  Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part I: A Model , 2009 .

[28]  P. Vianco,et al.  Dynamic Recrystallization (DRX) as the Mechanism for Sn Whisker Development. Part II: Experimental Study , 2009 .

[29]  Michael Osterman,et al.  Examination of nickel underlayer as a tin whisker mitigator , 2009, 2009 59th Electronic Components and Technology Conference.

[30]  D. Raabe,et al.  The use of flat punch indentation to determine the viscoelastic properties in the time and frequency domains of a soft layer bonded to a rigid substrate. , 2009, Acta biomaterialia.

[31]  Y. Lai,et al.  Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization , 2008, 2008 58th Electronic Components and Technology Conference.

[32]  B. Ebersberger,et al.  Cu pillar bumps as a lead-free drop-in replacement for solder-bumped, flip-chip interconnects , 2008, 2008 58th Electronic Components and Technology Conference.

[33]  Y. Lin Investigation of the Moisture-Desorption Characteristics of Epoxy Resin , 2007 .

[34]  Albert T. Wu,et al.  Stress analysis of spontaneous Sn whisker growth , 2006 .

[35]  Gery R. Stafford,et al.  Whisker and Hillock formation on Sn, Sn–Cu and Sn–Pb electrodeposits , 2005 .

[36]  Chen, Xu,et al.  Driving force for the formation of Sn whiskers: compressive stress-pathways for its generation and remedies for its elimination and minimization , 2005, IEEE Transactions on Electronics Packaging Manufacturing.

[37]  I. Ashcroft,et al.  Modelling anomalous moisture uptake, swelling and thermal characteristics of a rubber toughened epoxy adhesive , 2005 .

[38]  C.P. Wong,et al.  Recent advances in flip-chip underfill: materials, process, and reliability , 2004, IEEE Transactions on Advanced Packaging.

[39]  Tu,et al.  Irreversible processes of spontaneous whisker growth in bimetallic Cu-Sn thin-film reactions. , 1994, Physical review. B, Condensed matter.

[40]  D. Cebon,et al.  Materials Selection in Mechanical Design , 1992 .