Recent developments in infrared and visible imaging for astronomy, defense, and homeland security

Recent developments at Rockwell Scientific in the advancement of infrared and visible Focal Plane Array (FPA) technologies is presented. The technologies reviewed are hybrid silicon PIN visible, substrate-removed IR/VIS, MCT on silicon, 2-color, large format NIR FPAs, system-on-a-chip technology, and mosaic packaging. The basic aspects of each technology is described followed by a review of present performance achieved and the path for further development.