Impact of non-uniform wrinkles for a multi-stack pellicle in EUV lithography

Extreme ultraviolet (EUV) pellicle is required for protecting the EUV mask from defects, contaminations, and particles during exposure process. EUV pellicle should be very thin for high transmission of EUV wavelength. Therefore, EUV pellicle can be easily deformed during the exposure process, and the multi-stack pellicle is suggested to minimize this deformation of EUV pellicle. The EUV multi-stack pellicle is made of polysilicon-based core layer and capping layers for the durability during the exposure process. Nevertheless, there remains other manufacturing, thermal, and mechanical problems. In this study, we investigated the impact of wrinkles of EUV pellicle, which can be formed during pellicle manufacturing or exposure process, in terms of transmission non-uniformity and critical dimension (CD) variation for 5- nm and 3-nm nodes. To fabricate 3-nm node, we need a high numerical aperture (NA) system such as an anamorphic NA system with chief ray angle of 6-degree. The wrinkle can be uniform in height and period, but we assumed a realistic non-uniform wrinkle. This non-uniform wrinkle of multi-stack pellicle may cause different image distortion for 5-nm and 3-nm nodes with the isomorphic and anamorphic NA systems. The transmission non-uniformity is calculated with various heights and periods of non-uniform wrinkles of the pellicle. It is found that the transmission non-uniformity for wrinkled pellicle for the anamorphic NA system can be larger than that for the isomorphic NA system to obtain CD uniformity below 0.2 nm.

[1]  Pei-Yang Yan,et al.  EUVL mask with Ru ML capping , 2003, SPIE Photomask Technology.

[2]  Osamu Suga,et al.  Novel EUV mask inspection tool with 199-nm laser source and high-resolution optics , 2009, Photomask Technology.

[3]  Shmoolik Mangan,et al.  EUV mask: detection studies with Aera2 , 2010, Advanced Lithography.

[4]  Luigi Scaccabarozzi,et al.  Investigation of EUV pellicle feasibility , 2013, Advanced Lithography.

[5]  Shmoolik Mangan,et al.  Results from a novel EUV mask inspection by 193nm DUV system , 2010, Advanced Lithography.

[6]  V. Bakshi EUV Lithography , 2008 .

[7]  Harry J. Levinson,et al.  Principles of Lithography , 2001 .

[8]  Kazuo Tawarayama,et al.  Printability of EUVL mask defect detected by actinic blank inspection tool and 199-nm pattern inspection tool , 2010, Photomask Technology.

[9]  Sascha Migura,et al.  EUV lithography scanner for sub-8nm resolution , 2015, Advanced Lithography.

[10]  John Zimmerman,et al.  Progress on EUV pellicle development , 2014, Advanced Lithography.

[11]  Adam R. Pawloski,et al.  Defect printability study using EUV lithography , 2006, SPIE Advanced Lithography.

[12]  J. Miles,et al.  Thin film membrane wrinkling due to mechanical and thermal loads , 2001 .

[13]  Wrinkling of Thin Membrane Under Thermal Loading , 2006 .

[14]  Han-Ku Cho,et al.  Current status of EUV mask inspection using 193nm optical inspection system in 30nm node and beyond , 2011, European Mask and Lithography Conference.

[15]  S. Pellegrino,et al.  Computation of Wrinkle Amplitudes in Thin Membranes , 2002 .

[16]  Naoya Hayashi,et al.  EUV-mask pattern inspection using current DUV reticle inspection tool , 2007, Photomask Japan.

[17]  Ted Liang,et al.  Printability of extreme ultraviolet lithography mask pattern defects for 22-40 nm half-pitch features , 2010, Advanced Lithography.

[18]  B. L. Henke,et al.  X-Ray Interactions: Photoabsorption, Scattering, Transmission, and Reflection at E = 50-30,000 eV, Z = 1-92 , 1993 .

[19]  Bryan J. Rice,et al.  EUV pellicle development for mask defect control , 2006, SPIE Advanced Lithography.

[20]  Bernhard Kneer,et al.  EUV lithography optics for sub-9nm resolution , 2015, Advanced Lithography.

[21]  C. Mack Fundamental principles of optical lithography : the science of microfabrication , 2007 .

[22]  Pei-yang Yan,et al.  Printability of pellicle defects in DUV 0.5-um lithography , 1992, Other Conferences.

[23]  Mark van de Kerkhof,et al.  NXE pellicle: offering a EUV pellicle solution to the industry , 2016, SPIE Advanced Lithography.

[24]  Eric M. Gullikson,et al.  Evaluation of alternative capping layers for EUVL mask ML blank , 2005, SPIE Photomask Technology.

[25]  Han-Ku Cho,et al.  EUVL mask inspection using 193nm wavelength for 30nm node and beyond , 2011, Photomask Technology.

[26]  Edita Tejnil,et al.  Pattern Inspection of EUV Masks Using DUV Light , 2002, Photomask Technology.