Package module of battery protection circuits using flip chip

PURPOSE: A package module of a battery protection circuit is provided to minimize wire bonding, to improve electro conductivity through flip-chip bonding, and to reduce the production costs. CONSTITUTION: A package module of a battery protection circuit comprises: first and second interconnection terminal regions in which first and second interconnection terminals connected to a battery can with a bare cell are aligned respectively; an outer connection terminal region in which plural outer connection terminals are aligned; and one flip-chip having first and second FETs with a common drain structure, and a protection IC circuit. The package module comprises: a packaged structure which has a protection circuit area adjacent to the flip-chip in which plural manual components with resistance and a capacitor are aligned; plural outer connection terminals exposed on the top surface; and the first and second interconnection terminals exposed on the bottom surface.