Pulsed magnetron sputtering - process overview and applications
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voltage reversals suppress arc formation at the target (a major problem during the deposition of dielectrics) and provide long-term process stability. Thus, high quality, defect-free coatings of these materials can now be deposited at competitive rates. However, pulsing the magnetron discharge in this frequency range also strongly modifies the deposition plasma; raising the time averaged electron temperature and the energy flux delivered to the substrate, in comparison with continuous DC processing. These advantageous deposition conditions have been exploited in the deposition of materials such as titanium nitride, where arcing is not considered a problem. In this case, coatings deposited by pulsed processing demonstrated enhanced structures and tribological properties in comparison with conventional coatings. This paper gives an overview of the pulsed magnetron sputtering process (pulsed DC and mid-frequency AC), describes the underlying plasma physics, gives examples of successful applications of this technology and briefly considers recent developments in this field, such as high power impulse pulsed magnetron sputtering (HIPIMS).