Mechanisms of abrasive polishing
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Abstract Direct evidence is obtained, using the scanning electron microscope, that fine abrasive polishing operations can occur by a mechanical mechanism in which very small chips are cut. The difference between polishing and abrasion in this respect is only one of degree. Evidence is presented to show how the abrasive particles are held so that they may act as planing tools, and the resultant complexity of the factors likely to affect polishing rate is discussed. Some consideration is also given to other possible mechanisms of polishing.
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