Burn-in reduction using principal component analysis

A burn-in reduction screen is presented based on a subset of measurements from the wafer sort data. The subset of wafer sort data is identified by a principal component analysis (PCA) using die passing all the tests. This paper addresses the curse of dimensionality and shows the importance of reducing the dimensions in segregating the potential reliability fails for additional screening from the normal healthy population. The method presented is demonstrated using 90nm volume data and compared to 8 hour burn-in experiments