Electromagnetic Characterization of the Intrachip Propagation Channel in $Ka$ - and $V$ -Bands

This article presents the implementation of the intrachip propagation channel in the case of a wireless interconnect network-on-chip used for parallel computing applications. These wireless interconnects still require precise propagation models to demonstrate that they can be considered as a realistic efficient alternative to the wired interconnects. First, we show the advantages of wireless solutions for broadcast applications. As this type of circuit will be realized using silicon as the main component, we present in the literature review the problems and constraints of integrated antennas and channels on silicon. Then, a deep electromagnetic study for the intrachip transmission is conducted, with measurements done using two manufactured prototypes of printed dipole antennas on silicon in the Ka-band (26–40 GHz) and in the $V$ -band (40–75 GHz) with different scenarios. The good agreement between simulations and measurements validates the problems encountered due to the silicon substrate and its environment. Finally, we propose perspective solutions in order to improve the intrachip transmission on integrated circuits and to prove the feasibility of the wireless network on chip using integrated antennas.