GaAs-SOI integration as a path to low-cost optical interconnects

We present a concept where GaAs chips with dilute nitride and quantum dot optoelectronics are hybrid integrated on a silicon-on-insulator (SOI) waveguide platform and packaged into low-cost modules using silicon as the packaging material. The approach aims to offer high energy efficiency, low cost and high bandwidth for optical interconnects operating at 1.2-1.3 μm wavelengths. It presents technologies that could bridge the gap between long and short range optical communication, which are presently based on incompatible wavelength ranges and waveguiding technologies (single vs. multimode).

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