论文信息 - Fine pitch 3D-TSV based high frequency components for RF MEMS applications - 字舞流文

Fine pitch 3D-TSV based high frequency components for RF MEMS applications

I. Ocket | P. Ramm | A. Ionescu | W. De Raedt | W. Vitale | R. Merkel | M. Fernandez-Bolaños | A. Enayati | J. Weber