Signal integrity and design consideration of an MCM for video graphic acceleration

This paper introduces a cost effective MCM for video graphic acceleration of mobile computers. A 1.7 million gate graphic processor IC and two 8 Mbyte DRAM chips are integrated into a 31/spl times/31 mm 4-layer PBGA. Signal integrity analysis and measurement has been done to optimize performance of the present design and a direction for improvement for the next generation product is given thereafter. This study shows that greater consideration given to the MCM application at the IC design stage will maximize MCM performance.

[1]  Eric D. Perfecto,et al.  Thin-film multichip module packages for high-end IBM servers , 1998, IBM J. Res. Dev..

[3]  Samiha Mourad,et al.  Crosstalk in Deep Submicron DRAMs , 2000, MTDT.

[4]  Naoaki Yamanaka,et al.  Advanced ATM-layer function MCM-D module for ATM wide-area network , 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

[5]  Jiayuan Fang,et al.  Optimum placement of decoupling capacitors on packages and printed circuit boards under the guidance of electromagnetic field simulation , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[6]  Jr. A. Blodgett.  A Multilayer Ceramic Multichip Module , 1980 .

[7]  Sebastien George,et al.  Mixed L.F./R.F. MCM , 1997 .

[8]  X. A. Wang,et al.  The MCM/MCP thermal characteristic and its circuit representations , 1997, 1997 Proceedings 47th Electronic Components and Technology Conference.

[9]  Howard H. Smith,et al.  MCM technology and design for the S/390 G5 system , 1999, IBM J. Res. Dev..

[10]  Christopher Henry Bajorek,et al.  The thin-film module as a high-performance semiconductor package , 1982 .

[11]  E. E. Davidson,et al.  Electrical design of a high speed computer package , 1982 .

[12]  E. Fulcher,et al.  A four ASIC MCM-C, design for manufacturability and the next generation silicon , 1995 .

[13]  Jeffrey A. Gregus,et al.  Chip-scale modules for high-level integration in the 21st century , 1998, Bell Labs Technical Journal.

[14]  John A. Waicukauski,et al.  Multi-chip module test and diagnostic methodology , 1983 .

[15]  B. K. Gilbert,et al.  Design and test methodology for an analog-to-digital converter multichip module for experimental all-digital radar receiver operating at 2 gigasamples/s , 1999, ECTC 1999.

[16]  R. C. Frye,et al.  The impact of miniaturization and passive component integration in emerging MCM applications , 1997, Proceedings 1997 IEEE Multi-Chip Module Conference.