Revolutionary NanoSilicon Ancillary Technologies for Ultimate-Performance Gigascale Systems

This paper describes electrical, optical, and fluidic (or 'trimodal') chip I/O interconnect networks for gigascale systems to meet and exceed end-of-roadmap projections in the areas of power delivery, off-chip bandwidth, and heat removal, respectively. The trimodal I/O technology is proposed to overcome the adverse effects of conventional silicon ancillary technologies on the performance of a gigascale system. We describe trimodal I/O interconnect configurations, fabrication, assembly, and testing.

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