Comparison of advanced plasma sources for etching applications. V. Polysilicon etching rate, uniformity, profile control, and bulk plasma properties in a helical resonator plasma source
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F. Klemens | J.T.-C. Lee | H. Maynard | K. Guinn | N. Layadi | I. Tepermeister | D. Ibbotson | R. Richardson | P. Egan