Developer effect on the negative tone development process under low NILS conditions
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Young Cheol Bae | George G. Barclay | Seung-Hyun Lee | Lori Anne Joesten | Rosemary Bell | Seung-Hyun Lee | Y. Bae | R. Bell | L. Joesten | G. Barclay
[1] James W. Thackeray,et al. Deep UV ANR Photoresists For 248 nm Excimer Laser Photolithography , 1989, Advanced Lithography.
[2] James W. Thackeray,et al. Dissolution inhibition mechanism of ANR photoresists: crosslinking vs. -OH site consumption , 1991, Other Conferences.
[3] Chris A. Mack,et al. Fundamental differences between positive- and negative-tone imaging , 1992, Advanced Lithography.
[4] C. Zhang,et al. Relief and Functional Photoimaging with Chemically Amplified Resists Based on Di-tert-Butyl Butenedioate-co-Styrene , 1995 .
[5] Takeo Hashimoto,et al. Comparison between optical proximity effect of positive and negative tone patterns in KrF lithography , 1997, Advanced Lithography.
[6] M. Asano. Sub-100 nm Lithography with KrF Exposure Using Multiple Development Method , 1999 .
[7] Takeshi Iwai,et al. Chemically amplified negative-tone resist using novel acryl polymer for 193-nm lithography , 1999, Advanced Lithography.
[8] Jeff D. Byers,et al. Negative-tone 193-nm resists , 2000, Advanced Lithography.
[9] Will Conley,et al. Dual damascene photo process using negative-tone resist , 2000, Advanced Lithography.
[10] Lon A. Wang,et al. Negative-tone cycloolefin photoresist for 193-nm lithography , 2001, SPIE Advanced Lithography.
[11] Carlos Fonseca,et al. Optimum tone for various feature types: positive versus negative , 2001, SPIE Advanced Lithography.
[12] Harry J. Levinson,et al. Principles of Lithography , 2001 .
[13] P. Hewitt,et al. Positive Versus Negative Perfectionism in Psychopathology , 2006, Behavior modification.
[14] Hideaki Tsubaki,et al. Development of materials and processes for double patterning toward 32- nm node 193- nm immersion lithography process , 2008, SPIE Advanced Lithography.
[15] Mireille Maenhoudt,et al. Ultimate contact hole resolution using immersion lithography with line/space imaging , 2009, Advanced Lithography.
[16] Y. Bae,et al. Sub 30nm Node Contact Hole Patterning Using Immersion Single Exposure with Negative Tone Development , 2010 .
[17] Geert Vandenberghe,et al. Comparing positive and negative tone development process for printing the metal and contact layers of the 32- and 22-nm nodes , 2010 .