Integrating microelectromechanical systems with integrated circuits
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J. Bryzek | A. Flannery | D. Skurnik | J. Bryzek | D. Skurnik | A. Flannery
[1] J. Bryzek,et al. Control issues for MEMS , 2003, 42nd IEEE International Conference on Decision and Control (IEEE Cat. No.03CH37475).
[2] K. Wise,et al. A monolithic fully-integrated vacuum-sealed CMOS pressure sensor , 2000, Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308).
[3] S. V. D. Groen,et al. Substrate bonding techniques for CMOS processed wafers , 1997 .
[4] Chin C. Lee,et al. Fluxless InSn bonding process at 140 °C , 2002 .
[5] Joseph M. Kahn,et al. An autonomous 16 mm/sup 3/ solar-powered node for distributed wireless sensor networks , 2002, Proceedings of IEEE Sensors.
[6] Charles S. Smith. Piezoresistance Effect in Germanium and Silicon , 1954 .
[7] Bao Vu,et al. Patterned eutectic bonding with Al/Ge thin films for microelectromechanical systems , 1996 .
[8] G. Stemme,et al. Low temperature full wafer adhesive bonding , 2001 .