论文信息 - High-${Q}$ Transformers in Copper-Interconnection CMOS Technology

High-${Q}$ Transformers in Copper-Interconnection CMOS Technology

This paper proposes the adoption of aluminum-pad (AL-pad) film to improve the performance of on-chip transformers using current CMOS technology. Two devices proposed in this paper use an AL-pad film, without adding extra process, to enhance the Q value and bandwidth in the copper-interconnection process. The first device changes the transformer's coil location to increase the peak Q value and operation bandwidth, and the second device alters the coil material to improve the Q value in the entire operating band. A foundry 0.13-¿m CMOS technology is fabricated the proposed transformers. The measurement results demonstrate that the first proposed device improves the peak Q value and operation bandwidth with the values of 32.5% and 22.6%, respectively. Afterward, the second proposed device increases the peak Q value 44.7% more than the standard device.

Heng-Ming Hsu | Hung-Chi Chien

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