High density packaging Technology research & Development roadmap in Japan

This ASET Electronic System Integration activity program has been supported by the New Energy and Industrial Technology Development Organization .(NEDO) for the high density packaging Technology research, development and construction as one of the advanced key factor of the future electronics industries roadmap in Japan. This paper shows the key technology trend, the needs background and their progress aspect in the important field of the high density packaging technology development activity, especially 3 Dimensional packaging and Opt-Electronics packaging technology in Japan.