Novel high-Q bondwire inductor for MMIC
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A novel high-Q on-chip inductor using bondwire loops is proposed for low cost and high performance GaAs MMIC. The measured maximum quality factor and the self-resonant frequency are 21.1 (26.5) and 11.3 (17.0) GHz for 3.5 (2.1) nH inductance, respectively. The electrical variations are measured within 5% tolerance. The on-chip bondwire inductor can be effectively used for developing GaAs MMIC with no external inductors.
[1] T. Itoh,et al. Phenomenological loss equivalence method for planar quasi-TEM transmission lines with a thin normal conductor or superconductor , 1989 .
[2] Hai-Young Lee,et al. Wideband characterization of a typical bonding wire for microwave and millimeter-wave integrated circuits , 1995 .
[3] B. Shu. Fine pitch wire bonding development using a new multipurpose, multi-pad pitch test die , 1991, 1991 Proceedings 41st Electronic Components & Technology Conference.