TURBULENT FLUID FLOWS AND HEAT TRANSFER CHARACTERISTICS IN FLOW CHANNELS WITH DISTRIBUTED CHIP MODULES

A study is carried out to investigate the characteristics of turbulent fluid flow and heat transfer in the entrance region of a flow channel containing heat-generating modules of different sizes and distributions. The flow is described by Reynolds averaged Navier–Stokes equations and k-e model with wall function treatment. The prediction for flow and heat transfer characteristics has been made and compared with published experimental results. The computational results showed good agreement for performance parameters such as Nusselt numbers and Coefficient of pressure with experiments. The investigation is performed for Reynolds number values of 5000 and 15,000, and for two different geometrical configurations. Flow and heat transfer characteristics with varying parameters are also discussed.

[1]  N. K. Anand,et al.  Turbulent Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources , 1994 .

[2]  Klaus Bremhorst,et al.  A Modified Form of the k-ε Model for Predicting Wall Turbulence , 1981 .

[3]  Asako Yutaka,et al.  Three-dimensional heat transfer analysis of arrays of heated square blocks , 1989 .

[4]  Mohammad Faghri,et al.  PREDICTION OF TURBULENT HEAT TRANSFER IN THE ENTRANCE OF AN ARRAY OF HEATED BLOCKS USING LOW-REYNOLDS-NUMBER κ-ε MODEL , 1994 .

[5]  Mohammad Faghri,et al.  A Correlation for Heat Transfer and Wake Effect in the Entrance Region of an In-Line Array of Rectangular Blocks Simulating Electronic Components , 1995 .

[6]  Ephraim M Sparrow,et al.  Convective heat transfer response to height differences in an array of block-like electronic components , 1984 .

[7]  Yutaka Asako,et al.  Three-Dimensional Heat Transfer and Fluid Flow Analysis of Arrays of Square Blocks Encountered in Electronic Equipment , 1988 .

[8]  Pradip Majumdar,et al.  A COMPUTATIONAL MODEL FOR FORCED CONVECTION COOLING IN ELECTRONIC COMPONENTS , 1995 .

[9]  C. W. Hirt,et al.  Calculating three-dimensional flows around structures and over rough terrain☆ , 1972 .

[10]  B. Launder,et al.  The numerical computation of turbulent flows , 1990 .

[11]  Ephraim M Sparrow,et al.  Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment , 1982 .

[12]  F. Harlow,et al.  Numerical Calculation of Time‐Dependent Viscous Incompressible Flow of Fluid with Free Surface , 1965 .

[13]  B. P. Leonard,et al.  A stable and accurate convective modelling procedure based on quadratic upstream interpolation , 1990 .

[14]  Y. Asako,et al.  TURBULENT THREE-DIMENSIONAL HEAT TRANSFER ANALYSIS OF ARRAYS OF HEATED BLOCKS , 1990 .

[15]  Wilson F. N. Santos,et al.  Heat-transfer and pressure drop experiments in air-cooled electronic-component arrays , 1986 .

[16]  Mohammad Faghri,et al.  A New Correlation for Pressure Drop in Arrays of Rectangular Blocks in Air-Cooled Electronic Units , 1994 .

[17]  Mohammad Faghri,et al.  Parametric study of turbulent three-dimensional heat transfer of arrays of heated blocks encountered in electronic equipment , 1991 .