论文信息 - Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage - 字舞流文

Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage

J. Osenbach | M. Bachman | D. Gerlach | D. Crouthamel | J. Delucca | F. Baiocchi | R. Weachock | A. Amin | C. Peridier | D. Bitting | J. Goodell | M. Stahley