Thermal Field Management for Many-core Processors
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[1] Tajana Simunic,et al. Static and Dynamic Temperature-Aware Scheduling for Multiprocessor SoCs , 2008, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.
[2] Deepak Chandra Sekar,et al. Optimal signal, power, clock and thermal interconnect networks for high-performance 2d and 3d integrated circuits , 2008 .
[3] Kevin Skadron,et al. Many-core design from a thermal perspective , 2008, 2008 45th ACM/IEEE Design Automation Conference.
[4] David Wentzlaff,et al. Processor: A 64-Core SoC with Mesh Interconnect , 2010 .
[5] S. Borkar,et al. An 80-Tile Sub-100-W TeraFLOPS Processor in 65-nm CMOS , 2008, IEEE Journal of Solid-State Circuits.
[6] Reza Sarvari,et al. Intsim: a CAD tool for optimization of multilevel interconnect networks , 2007, 2007 IEEE/ACM International Conference on Computer-Aided Design.
[7] José González,et al. Understanding the Thermal Implications of Multi-Core Architectures , 2007, IEEE Transactions on Parallel and Distributed Systems.
[8] Saurabh Dighe,et al. Adaptive Frequency and Biasing Techniques for Tolerance to Dynamic Temperature-Voltage Variations and Aging , 2007, 2007 IEEE International Solid-State Circuits Conference. Digest of Technical Papers.
[9] Shekhar Y. Borkar,et al. Thousand Core ChipsA Technology Perspective , 2007, 2007 44th ACM/IEEE Design Automation Conference.
[10] Kevin Skadron,et al. HotSpot: a compact thermal modeling methodology for early-stage VLSI design , 2006, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.
[11] S. Naffziger,et al. Power and temperature control on a 90-nm Itanium family processor , 2006, IEEE Journal of Solid-State Circuits.
[12] Kevin Skadron,et al. A Case for Thermal-Aware Floorplanning at the Microarchitectural Level , 2005, J. Instr. Level Parallelism.
[13] Pradip Bose,et al. The case for lifetime reliability-aware microprocessors , 2004, Proceedings. 31st Annual International Symposium on Computer Architecture, 2004..
[14] Guoping Xu,et al. Substantiation of numerical analysis methodology for CPU package with non-uniform heat dissipation and heat sink with simplified fin modeling , 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).
[15] Margaret Martonosi,et al. Dynamic thermal management for high-performance microprocessors , 2001, Proceedings HPCA Seventh International Symposium on High-Performance Computer Architecture.