Coupled Analysis of Quasi-static and Full-Wave Solution towards IC, Package and Board Co-design
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S. Wane | Jifeng Mao | An-Yu Kuo | G. Fitzgerald | S. Wane | A. Kuo | G. Fitzgerald | J. Mao
[1] D. Pozar. Microwave Engineering , 1990 .
[2] F. Murray. Silicon based system-in-package: a passive integration technology combined with advanced packaging and system based design tools to allow a breakthrough in miniaturization , 2005, Proceedings of the Bipolar/BiCMOS Circuits and Technology Meeting, 2005..
[3] Michael J. Howes,et al. Improved calibration and measurement of the scattering parameters of microwave integrated circuits , 1989 .
[4] Ke Wu,et al. Comparative investigation on numerical de-embedding techniques for equivalent circuit modeling of lumped and distributed microstrip circuits , 2002 .