Explaining `Voltage-Driven' Breakdown Statistics by Accurately Modeling Leakage Current Increase in Thin SiON and SiO2/High-K Stacks
暂无分享,去创建一个
R. Degraeve | B. Kaczer | F. Crupi | G. Groeseneken | T. Kauerauf | R. Degraeve | B. Kaczer | G. Groeseneken | T. Kauerauf | M. Cho | F. Crupi | P. Roussel | M. Cho | Ph. Roussel
[1] R. Degraeve,et al. On the trap generation rate in ultrathin SiON under constant voltage stress , 2005 .
[2] S. De Gendt,et al. Degradation and breakdown of 0.9 nm EOT SiO/sub 2/ ALD HfO/sub 2/metal gate stacks under positive constant voltage stress , 2005, IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..
[3] D. Hwang,et al. Ultra-thin gate dielectrics: they break down, but do they fail? , 1997, International Electron Devices Meeting. IEDM Technical Digest.
[4] Anabela Veloso,et al. Weibull slope and voltage acceleration of ultra-thin (1.1-1.45 nm EOT) oxynitrides , 2004 .
[5] R. Degraeve,et al. Measurement and statistical analysis of single trap current-voltage characteristics in ultrathin SiON , 2005, 2005 IEEE International Reliability Physics Symposium, 2005. Proceedings. 43rd Annual..
[6] R. Degraeve,et al. Analytical percolation model for predicting anomalous charge loss in flash memories , 2004, IEEE Transactions on Electron Devices.
[7] Muhammad A. Alam,et al. A study of soft and hard breakdown - Part I: Analysis of statistical percolation conductance , 2002 .
[8] Jordi Suñé,et al. Experimental evidence of T/sub BD/ power-law for voltage dependence of oxide breakdown in ultrathin gate oxides , 2002 .
[9] Byung Jin Cho,et al. Quasi-breakdown of ultrathin gate oxide under high field stress , 1994, Proceedings of 1994 IEEE International Electron Devices Meeting.
[10] G. Ghibaudo,et al. A thorough investigation of progressive breakdown in ultra-thin oxides. Physical understanding and application for industrial reliability assessment , 2002, 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320).
[11] R. Degraeve,et al. Constant current charge-to-breakdown: Still a valid tool to study the reliability of MOS structures? , 1998, 1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173).
[12] R. Degraeve,et al. Implications of progressive wear-out for lifetime extrapolation of ultra-thin (EOT /spl sim/ 1 nm) SiON films , 2004, IEDM Technical Digest. IEEE International Electron Devices Meeting, 2004..
[13] K. Taniguchi,et al. A detailed study of soft- and pre-soft-breakdowns in small geometry MOS structures , 1998, International Electron Devices Meeting 1998. Technical Digest (Cat. No.98CH36217).
[14] J. Sune,et al. Critical assessment of soft breakdown stability time and the implementation of new post-breakdown methodology for ultra-thin gate oxides [MOSFET] , 2003, IEEE International Electron Devices Meeting 2003.
[15] S. Lombardo,et al. Voltage dependence of hard breakdown growth and the reliability implication in thin dielectrics , 2002, IEEE Electron Device Letters.
[16] R. Degraeve,et al. Accurate and robust noise-based trigger algorithm for soft breakdown detection in ultrathin gate dielectrics , 2001 .
[17] Miss A.O. Penney. (b) , 1974, The New Yale Book of Quotations.
[18] R. K. Smith,et al. A phenomenological theory of correlated multiple soft-breakdown events in ultra-thin gate dielectrics , 2003, 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual..
[19] Guido Groeseneken,et al. New insights in the relation between electron trap generation and the statistical properties of oxide breakdown , 1998 .
[20] S. De Gendt,et al. Abrupt breakdown in dielectric/metal gate stacks: a potential reliability limitation? , 2005, IEEE Electron Device Letters.
[21] Andrea L. Lacaita,et al. A statistical model for SILC in flash memories , 2002 .
[22] S. De Gendt,et al. High performing 8 A EOT HfO/sub 2//TaN low thermal-budget n-channel FETs with solid-phase epitaxially regrown (SPER) junctions , 2005, Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005..
[24] A. Ghetti,et al. Field acceleration for oxide breakdown-can an accurate anode hole injection model resolve the E vs. 1/E controversy? , 2000, 2000 IEEE International Reliability Physics Symposium Proceedings. 38th Annual (Cat. No.00CH37059).
[25] J.S. Suehle,et al. Impact of the trapping of anode hot holes on silicon dioxide breakdown , 2002, IEEE Electron Device Letters.
[26] J. Sune,et al. A new quantitative hydrogen-based model for ultra-thin oxide breakdown , 2001, 2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184).
[27] F.R. McFeely,et al. Degradation of ultra-thin oxides with tungsten gates under high voltage: wear-out and breakdown transient , 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.
[28] Atsushi Hiraiwa,et al. Voltage-driven distribution of gate oxide breakdown , 2003, 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual..
[29] Roberto Saletti,et al. Current fluctuations and silicon oxide wear-out in metal-oxide-semiconductor tunnel diodes , 1988 .
[30] J.S. Suehle,et al. Acceleration factors and mechanistic study of progressive breakdown in small area ultra-thin gate oxides , 2004, 2004 IEEE International Reliability Physics Symposium. Proceedings.