Air cooling characteristics of a uniform square modules array for electronic device heat sink
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[1] Rachid Bessaïh,et al. Turbulent natural convection cooling of electronic components mounted on a vertical channel , 2000 .
[2] Ephraim M Sparrow,et al. Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment , 1982 .
[3] Ivan Catton,et al. Numerical technique for modeling conjugate heat transfer in an electronic device heat sink , 2003 .
[4] J. P. Sullivan,et al. Air cooling of front-end electronics for silicon detectors in a collider experiment , 1994 .
[5] Ahmed Al-Salaymeh,et al. Thermal wakes measurement in electronic modules in the presence of heat transfer enhancement devices , 1999 .
[6] B. A. Jubran,et al. Heat Transfer Enhancement in Electronic Modules Using Various Secondary Air Injection Hole Arrangements , 1998 .
[7] B. A. Jubran,et al. Heat transfer enhancement in electronic modules using ribs and “film-cooling-like” techniques , 1996 .
[8] Meir Shillor,et al. Optimal placement of heat sources on a rectangular grid , 1992 .
[9] Tsing-Fa Lin,et al. Structure of mixed convective longitudinal vortex air flow driven by a heated circular plate embedded in the bottom of a horizontal flat duct , 2003 .
[10] Hajime Nakamura,et al. Pressure drop and heat transfer of arrays of in-line circular blocks on the wall of parallel channel , 2004 .
[11] Ephraim M Sparrow,et al. Convective heat transfer response to height differences in an array of block-like electronic components , 1984 .
[12] G. Sultan,et al. Enhancing forced convection heat transfer from multiple protruding heat sources simulating electronic components in a horizontal channel by passive cooling , 2000 .
[13] Sam Z. Zhao. Thermal design of a broadband communication system with detailed modeling of TBGA packages , 2003, Microelectron. Reliab..
[14] S. D. Probert,et al. Horizontal simulated printed-circuit board assembly in fully-developed laminar-flow convection , 1997 .
[15] Tian Jian Lu,et al. Analysis of microchannel heat sinks for electronics cooling , 2002 .
[16] B. A. Jubran,et al. Convective heat transfer and pressure drop characteristics of various array configurations to simulate the cooling of electronic modules , 1996 .
[17] Y. Islamoglu,et al. Heat transfer analysis using ANNs with experimental data for air flowing in corrugated channels , 2004 .