Bonding technology based on solid porous Ag for large area chips

[1]  K. Suganuma,et al.  Mechanical Deformation of Sintered Porous Ag Die Attach at High Temperature and Its Size Effect for Wide-Bandgap Power Device Design , 2017, Journal of Electronic Materials.

[2]  Katsuaki Suganuma,et al.  Thermal Fatigue Behavior of Silicon-Carbide-Doped Silver Microflake Sinter Joints for Die Attachment in Silicon/Silicon Carbide Power Devices , 2017, Journal of Electronic Materials.

[3]  K. Suganuma,et al.  Dry-growth of silver single-crystal nanowires from porous Ag structure , 2016 .

[4]  G. Zou,et al.  Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications. , 2015, ACS applied materials & interfaces.

[5]  Katsuaki Suganuma,et al.  Ultra thermal stability of LED die-attach achieved by pressureless Ag stress-migration bonding at low temperature , 2015 .

[6]  Chulmin Oh,et al.  Pressureless Bonding Using Sputtered Ag Thin Films , 2014, Journal of Electronic Materials.

[7]  G. Lu,et al.  Pressureless sintering of nanosilver paste at low temperature to join large area (≥100mm2) power chips for electronic packaging , 2014 .

[8]  Philippe Godignon,et al.  Thermomechanical Assessment of Die-Attach Materials for Wide Bandgap Semiconductor Devices and Harsh Environment Applications , 2014, IEEE Transactions on Power Electronics.

[9]  Chulmin Oh,et al.  Pressureless wafer bonding by turning hillocks into abnormal grain growths in Ag films , 2014 .

[10]  Chunqing Wang,et al.  Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging , 2013 .

[11]  C. Handwerker,et al.  Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration , 2013 .

[12]  Chunqing Wang,et al.  Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles , 2012 .

[13]  M. Amano,et al.  Mechanical and electrical cold bonding based on metallic nanowire surface fasteners , 2012, Nanotechnology.

[14]  O. Løvvik,et al.  Au-Sn SLID Bonding—Properties and Possibilities , 2012, Metallurgical and Materials Transactions B.

[15]  K. S. Siow,et al.  Mechanical properties of nano-silver joints as die attach materials , 2012 .

[16]  K. S. Kim,et al.  Low-temperature low-pressure die attach with hybrid silver particle paste , 2012, Microelectron. Reliab..

[17]  Andrzej Dziedzic,et al.  10th Electron Technology ELTE 2010 and 34th International Microelectronics and Packaging IMAPS/CPMT Poland Joint Conference - Guest Editorial , 2011, Microelectron. Reliab..

[18]  K. Cheong,et al.  A Review on Die Attach Materials for SiC-Based High-Temperature Power Devices , 2010 .

[19]  Anant K. Agarwal,et al.  Performance, Reliability, and Robustness of 4H-SiC Power DMOSFETs , 2010 .

[20]  G. Lu,et al.  Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area $({>}100~{\rm mm}^{2})$ Chips , 2010, IEEE Transactions on Components and Packaging Technologies.

[21]  C. Kuo,et al.  Dependence of surface atomic arrangement of titanium dioxide on metallic nanowire nucleation by thermally assisted photoreduction. , 2010, Physical chemistry chemical physics : PCCP.

[22]  Ryszard Kisiel,et al.  Die-attachment solutions for SiC power devices , 2009, Microelectron. Reliab..

[23]  S. Isoda,et al.  Silver nanosintering: a lead-free alternative to soldering , 2008 .

[24]  M. Becker,et al.  Annealing of nanostructured silver films produced by supersonic deposition of nanoparticles , 2007 .

[25]  Tao Wang,et al.  Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection , 2007 .

[26]  M. Saka,et al.  Rapid and mass growth of stress-induced nanowhiskers on the surfaces of evaporated polycrystalline Cu films , 2007 .

[27]  Jong-Kai Lin,et al.  Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy , 2005 .

[28]  Kojiro F. Kobayashi,et al.  Metal-metal bonding process using Ag metallo-organic nanoparticles , 2005 .

[29]  E. Lugscheider,et al.  Characterisation and Optimisation of Innovative Solders for Transient Liquid Phase Bonding and Active Soldering , 2004 .

[30]  K. S. Kim,et al.  Isothermal aging characteristics of Sn-Pb micro solder bumps , 2003, Microelectron. Reliab..

[31]  F. Xu,et al.  Formation of Silver Nanowires Through a Sandwiched Reduction Process , 2003 .

[32]  Kristel Michielsen,et al.  Integral-geometry morphological image analysis , 2001 .

[33]  T. Eagar,et al.  Low Temperature Transient Liquid Phase (LTTLP) Bonding for Au/Cu and Cu/Cu Interconnections , 1992 .

[34]  Hsiu-Jen Lin,et al.  Rapid growth of tin whiskers on the surface of Sn–6.6Lu alloy , 2007 .

[35]  H. De Raedt,et al.  Aspects of Mathematical Morphology , 2002 .