Parameter optimization for an ICP deep silicon etching system
暂无分享,去创建一个
Lance Horng | Chiang-Ho Cheng | Y. C. Lin | Y. Lin | L. Horng | J. Wu | S. C. Chen | J. C. Wu | C. H. Cheng
[1] M. S. Phadke,et al. Quality Engineering using Design of Experiments , 1989 .
[2] Genichii Taguchi,et al. Introduction to quality engineering. designing quality into products a , 1986 .
[3] Madhan Shridhar Phadke,et al. Quality Engineering Using Robust Design , 1989 .
[4] Huma Ashraf,et al. Advanced silicon etching using high-density plasmas , 1995, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.
[5] D. Stamatis,et al. Orthogonal Arrays and Linear Graphs , 2002 .
[6] Ian Ronald Johnston,et al. Recent advances in silicon etching for MEMS using the ASE™ process , 1999 .
[7] Michael S. Saccucci,et al. Engineering, Quality and Experimental Design , 1992 .
[8] Wensyang Hsu,et al. Sidewall roughness control in advanced silicon etch process , 2003 .
[9] Chen-Kuei Chung,et al. Geometrical pattern effect on silicon deep etching by an inductively coupled plasma system , 2004 .