High-temperature failure of polycrystalline alumina: II, creep crack growth and blunting

Creep crack growth in fine-grain alumina is measured by using surface cracks. A narrow power-law crack growth regime occurs at both 1300° and 1400°C, wherein the power-law exponent and activation energy are comparable to steady-state creep values. Asymptotic crack velocity behavior is exhibited near both the critical stress intensity factor, KC, and the crack growth threshold, Kth. The threshold occurs near 0.4 K1C at both 1300° and 1400°C and is associated with a transition in the size and distribution of damage. Displacement measurements indicate that crack tip damage exerts a strong influence on the displacement field, as predicted by recent theories. Furthermore, use of the stress intensity factor as a loading parameter does not produce adequate correlation with displacement measurements and is, therefore, not strictly suitable for nonlinear creeping ceramic poly crystals.