A cooling system for a memory module includes a Warmeleitbaugruppe for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each Warmeleitbaugruppe includes a frame having opposed first and second mounts, first and second heat distribution plates, each extending from the first bracket to the second bracket, and a pair of flattened heat pipes each extending along a corresponding one of the heat distribution plates of the first bracket extend to the second bracket. The liquid-cooled mounting blocks hold the separable Warmeleitbaugruppe over a memory module socket, whereby the memory module between the heat spreader plates located.