Transfer mechanism and transfer method of semiconductor package
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The present invention includes a plurality of transfer to then is that, operating in particular, each independently of the semiconductor package transfer mechanism and the transfer method, pick up the individual semiconductor packages by up footage once the vision inspection unit, the vision without delay testing device and one vision inspection pickup apparatus, the vision that test work with for the pick-up device provided with a vision inspection device to be movable across the moving path of the pick-up device for the vision inspection is installed, the handler phase process of the semiconductor package over entire system by reducing the retention time and the waiting time it was to maximize the transfer efficiency and the vision inspection efficiency.