论文信息 - Taking optics to the chip: From board-mounted optical assemblies to chip-level optical interconnects

Taking optics to the chip: From board-mounted optical assemblies to chip-level optical interconnects

Board-mounted optical assemblies (BOAs) enable significant bandwidth density increase relative to pluggable optics at the card edge. We discuss the challenges for the next step in this evolution as optics moves towards the chip.

K. Schmidtke | F. Flens | Daniel Mahgarefteh

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