Thermal strain analysis of an electronics package using the SEM Moiré technique

This paper reports on a study of the scanning electron microscope (SEM) Moire method. Tests were carried out by rotating the specimen grating slightly with respect to the electron scanning raster lines, to verify that the Moire images captured were really due to the interference between specimen and reference gratings. The experimental results coincided well with the calculated theoretical values and with small measurement errors. Then, the shear strains experienced by the solder joints of a flip‐chip ball grid array specimen were investigated using the SEM Moire method. The results were compared with those obtained using the optical Moire method.

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