High density microwave packaging program

Although the HDMP program has limited financial resources, it is expected to result in considerable progress toward development of advanced T/R module and multi-chip assembly manufacturing procedures that are low cost but provide high quality performance. The manufacturing processes being developed are applicable to DoD phased array radar implementations as well as to a number of potential commercial applications such as transmission of entertainment to aircraft from satellite sources. In the future, programs such as the new Microwave and Analog Front End Technology (MAFET) program will augment the efforts begun under HDMP funding to provide additional computer aided design resources and to extend the development, assembly, and test of advanced MCAs to other frequency ranges and other applications.<<ETX>>