Thermomechanical studies of aluminum nitride filled shape memory polymer composites

High thermal conductivity polyurethane shape memory polymer (SMP) composites filled with aluminum nitride (AlN) were fabricated, and their thermal and thermomechanical properties were studied. The purpose of this microstructure is to improve the thermal properties of the SMPs at low filler content. Morphology of AlN filler in polyurethane SMP matrix and the resulting thermal conductivity was also investigated. Thermal studies have shown that AlN is an effective filler for reinforcement of the polyurethane SMP and that it does not deteriorate the stable physical crosslink structure of the polyurethane, which is necessary to store the elastic energy in the service process of the shape memory material. The thermal conductivities of these SMP composites in relation to filler concentration and temperature were investigated, and it was found that the thermal conductivity can increase up to 50 times in comparison with that of the pure SMP. Furthermore, differential scanning calorimetry tests have shown a significant decrease in the glass transition temperature of the switching segment. Dynamic mechanical studies have shown that the storage modulus of the composites increase with higher AlN content in both glassy and rubbery state. Damping peak decreases and also the curve of damping becomes broader with increasing filler content. Strain fixity rate which expresses the ability of the specimens to fix their strain has been improved slightly in the presence of AlN filler but the final recovery rate of the shape memory measurement has decreased evidently. POLYM. COMPOS., 28:287–293, 2007. © 2007 Society of Plastics Engineers

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