Modeling and Pareto Optimization of Microfabricated Inductors for Power Supply on Chip

Microfabricated inductors experience increasing interest and research activity because of their high potential in buck converters for power supply in package and power supply on chip applications. This paper details the modeling and optimization of microfabricated racetrack inductors. The analytical expressions derived characterize inductance, efficiency, and power density based on geometrical parameters, inductor current, and switching frequency. An accurate analysis of the inductor current that includes the impact of losses is performed to determine the switching frequency, the ac copper losses, and the core losses. The presented model is compared to finite element method simulations and reported results of three microfabricated inductors. Finally, the optimum tradeoff between efficiency and power density is identified using the Pareto front, which results from the evaluation of a large number of microfabricated inductors in the design space defined by the application.

[1]  Charles R. Sullivan,et al.  Integrating magnetics for on-chip power: Challenges and opportunities , 2009, 2009 IEEE Custom Integrated Circuits Conference.

[2]  Jan Abraham Ferreira,et al.  Improved analytical modeling of conductive losses in magnetic components , 1994 .

[3]  J. Biela,et al.  Core Losses Under the DC Bias Condition Based on Steinmetz Parameters , 2012, IEEE Transactions on Power Electronics.

[4]  S. Narendra,et al.  A 480-MHz, multi-phase interleaved buck DC-DC converter with hysteretic control , 2004, 2004 IEEE 35th Annual Power Electronics Specialists Conference (IEEE Cat. No.04CH37551).

[5]  S.C. O'Mathuna,et al.  Analysis of Microinductor Performance in a 20-100 MHz DC/DC Converter , 2009, IEEE Transactions on Power Electronics.

[6]  P. L. Dowell,et al.  Effects of eddy currents in transformer windings , 1966 .

[7]  Frederick Warren Grover,et al.  Inductance Calculations: Working Formulas and Tables , 1981 .

[8]  Cian O Mathuna,et al.  Integrated magnetics on silicon for power supply in package (PSiP) and power supply on chip (PwrSoC) , 2010, 3rd Electronics System Integration Technology Conference ESTC.

[9]  F. Herrault,et al.  Micro-fabricated thin-film inductors for on-chip power conversion , 2012, 2012 7th International Conference on Integrated Power Electronics Systems (CIPS).

[10]  Stephen P. Boyd,et al.  Simple accurate expressions for planar spiral inductances , 1999, IEEE J. Solid State Circuits.

[11]  J. A. Oliver,et al.  Power Electronics Enabling Efficient Energy Usage: Energy Savings Potential and Technological Challenges , 2012, IEEE Transactions on Power Electronics.

[12]  Charles R. Sullivan,et al.  Design of microfabricated inductors , 1996, PESC Record. 27th Annual IEEE Power Electronics Specialists Conference.

[13]  Johann W. Kolar,et al.  Inductor optimization procedure for Power Supply in Package and Power Supply on Chip , 2011, 2011 IEEE Energy Conversion Congress and Exposition.

[14]  Chang-Min Park,et al.  Design and Fabrication of On-Chip Coupled Inductors Integrated With Magnetic Material for Voltage Regulators , 2011, IEEE Transactions on Magnetics.

[15]  J. W. Kolar,et al.  Improved Core-Loss Calculation for Magnetic Components Employed in Power Electronic Systems , 2012, IEEE Transactions on Power Electronics.

[16]  T. O'Donnell,et al.  Thin-Film-Integrated Power Inductor on Si and Its Performance in an 8-MHz Buck Converter , 2008, IEEE Transactions on Magnetics.

[17]  Ashraf W. Lotfi Advances towards fully integrated, single chip power management , 2011, 2011 IEEE 33rd International Telecommunications Energy Conference (INTELEC).

[18]  S. Narendra,et al.  A 233-MHz 80%-87% efficient four-phase DC-DC converter utilizing air-core inductors on package , 2005, IEEE Journal of Solid-State Circuits.

[19]  J. Biela,et al.  Exploring the pareto front of multi-objective single-phase PFC rectifier design optimization - 99.2% efficiency vs. 7kW/din3 power density , 2009, 2009 IEEE 6th International Power Electronics and Motion Control Conference.

[20]  Raymond Foley,et al.  Technology Roadmapping for Power Supply in Package (PSiP) and Power Supply on Chip (PwrSoC) , 2013, IEEE Transactions on Power Electronics.

[21]  M. Steyaert,et al.  A fully-integrated 0.18µm CMOS DC-DC step-up converter, using a bondwire spiral inductor , 2007, ESSCIRC 2007 - 33rd European Solid-State Circuits Conference.