TSV density impact on 3D power delivery with high aspect ratio TSVs

This paper reports on modeling of the power delivery in TSV-based 3D systems, i.e., vertically integrated ICs with uniformly-distributed high-aspect-ratio through-silicon vias (TSVs). The voltage drop and di/dt noise are modeled to evaluate the impact of TSV density and TSV aspect ratio (AR). The frequency dependency of TSV parasitics is modeled with fullwave EM simulator, and the performance of the power delivery network (PDN) is analyzed in the frequency domain. PDNs with low-AR and high-AR TSVs are compared for trade-off analysis in terms of power delivery performance and TSV area occupation, which is critical for the design of TSV-based 3D power delivery.

[1]  Jian-Qiang Lu,et al.  Compact Models of Voltage Drops in Power Delivery Network for TSV-Based Three-Dimensional Integration , 2013, IEEE Electron Device Letters.

[2]  Manoj Sachdev,et al.  Analysis and Design of On-Chip Decoupling Capacitors , 2013, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

[3]  M. F. Chen,et al.  High-aspect ratio through silicon via (TSV) technology , 2012, 2012 Symposium on VLSI Technology (VLSIT).

[4]  Jian-Qiang Lu,et al.  3-D Hyperintegration and Packaging Technologies for Micro-Nano Systems , 2009, Proceedings of the IEEE.

[5]  B. Dang,et al.  3D silicon integration , 2008, 2008 58th Electronic Components and Technology Conference.

[6]  Zheng Xu,et al.  Crosstalk evaluation, suppression and modeling in 3D through-strata-via (TSV) network , 2010, 2010 IEEE International 3D Systems Integration Conference (3DIC).

[7]  Soha Hassoun,et al.  Power Delivery Design for 3-D ICs Using Different Through-Silicon Via (TSV) Technologies , 2011, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

[8]  Zheng Xu,et al.  Electromagnetic-SPICE modeling and analysis of 3D power network , 2011, 2011 IEEE 61st Electronic Components and Technology Conference (ECTC).

[9]  Eric Bogatin,et al.  Signal and Power Integrity - Simplified , 2009 .