A 600V super low loss IGBT with advanced micro-P structure for the next generation IPM

This paper describes a new 600V trench-gate field stop IGBT (FS-IGBT) with an advanced micro p-base (micro-P) structure in order to realize low on-state voltage drop and low Miller capacitance for the next generation 600V intelligent power module (IPM). The extra margin of the safe operating area (SOA) can be reduced by using improved over-current protection function in the IPMs, and collector-emitter saturation voltage is reduced more by the optimization of the SOA. The new 600V IGBT improved trade-off relationship between on-state voltage drop and turn-off power dissipation. The device also realizes low turn-on power dissipation without increasing radiation noise. As a result, total power dissipation of the new IGBT can be reduced by 14.2% compared to that of the conventional IGBT.

[1]  Masahito Otsuki,et al.  Current sensing IGBT structure with improved accuracy , 1995, Proceedings of International Symposium on Power Semiconductor Devices and IC's: ISPSD '95.

[2]  T. Laska,et al.  The Field Stop IGBT (FS IGBT). A new power device concept with a great improvement potential , 2000, 12th International Symposium on Power Semiconductor Devices & ICs. Proceedings (Cat. No.00CH37094).

[3]  Y. Onozawa Development of the next generation 1200V trench-gate FS-IGBT featuring lower EMI noise and lower switching loss , 2007, Proceedings of the 19th International Symposium on Power Semiconductor Devices and IC's.

[4]  Y. Onozawa,et al.  600V trench-gate IGBT with Micro-P structure , 2009, 2009 21st International Symposium on Power Semiconductor Devices & IC's.

[5]  Masahito Otsuki,et al.  A study on the short-circuit capability of field-stop IGBTs , 2003 .